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INTEGRATED CIRCUITS
DATA SHEET
HT1DC20S30 HITAG 1 stick transponder
Product specification Supersedes data of 2000 Apr 19 File under Integrated Circuits, IC11 2001 Sep 24
Philips Semiconductors
Product specification
HITAG 1 stick transponder
FEATURES * Complete identification transponder for use in contactless applications * Operating frequency 125 kHz * Data transmission and supply energy via RF link, no internal battery * Low power EEPROM technology for writing distance that equals reading distance * Total memory size 2048 bits * Parts of memory can be write protected by the user * Effective communication protocol with outstanding data integrity check * Secure mutual authentication function * Encrypted data transmission * Anticollision protocol for handling of multiple transponders inside the field of the reader antenna * Special features: - User defined write protection - Unique 32-bit serial number for each transponder - Encrypted data transmission possible. GENERAL DESCRIPTION The HITAG(1) stick transponder HT1DC20S30, based on the HITAG tag IC, is a high performance transponder for bi-directional data transmission in full-duplex mode. Data is stored in the transponder in a non-volatile memory (EEPROM).
(1) HITAG - is a trademark of Philips Semiconductors Gratkorn GmbH.
HT1DC20S30
The transponder acts as a passive device, thus not having the need for any internal power supply (battery). It derives power from the magnetic component of the RF resonant frequency generated by the reader. Data is transmitted by modulating this resonant frequency. The HT1DC20S30 is dedicated for use in secure access systems where the transponder and the reader have to identify each other. The EEPROM has a capacity of 2048 bits and is organised in 64 pages. Access is provided either in page mode or in block mode, where 1 block includes 4 pages. Data transmission from the HT1DC20S30 to the reader uses Manchester or biphase coding and Amplitude Shift Keying (ASK) modulation. Absorption modulation is used to transmit data from the transponder to the reader. The transponder absorbs the magnetic field which hence modulates the current in the reader antenna. Data transmission from the reader to the HT1DC20S30 uses Binary Pulse Length Modulation (BPLM). The anticollision feature of the transponder allows to operate several transponders simultaneously in the field of the reader antenna. To use that feature, the reader needs to have implemented the anticollision protocol and must be able to detect bit-collisions (e.g. the Philips HTRM800 long range reader module includes the anticollision protocol.
QUICK REFERENCE DATA SYMBOL f0 ftrans resonant frequency data transfer rate transponder to reader reader to transponder M memory size organization N encrypted mutual authentication bits serial number secret key - - 32 32 - - bits bits - - 2048 64 - - bits pages - - 4.0 5.2 - - kbits/s kbits/s PARAMETER MIN. 120 TYP. 125 MAX. 130 UNIT kHz
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Philips Semiconductors
Product specification
HITAG 1 stick transponder
ORDERING INFORMATION PACKAGE TYPE NUMBER NAME HT1DC20S30 BLOCK DIAGRAM PLLMC DESCRIPTION plastic leadless module carrier
HT1DC20S30
VERSION SOT385-1
handbook, full pagewidth
HT1DC20S30
CONTACTLESS INTERFACE RECTIFIER VOLTAGE LIMITER
CONTROL LOGIC DATA ACQUISITION
POWER-ON RESET
EEPROM ACCESS CONTROL
L
C
CLOCK RECOVERY CALCULATION UNIT MODULATOR
DEMODULATOR
EEPROM
TRANSPONDER IC
MGW173
Fig.1 Block diagram.
2001 Sep 24
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Philips Semiconductors
Product specification
HITAG 1 stick transponder
FUNCTIONAL DESCRIPTION Related documents For additional information on the functional description of the HT1DC20S30, in particular the protocol between reader and transponder please refer to the document "HT1 Transponder Family Communication Protocol Reader HITAG 1 Transponder" (document number HT038522).
HT1DC20S30
Write command - safety instructions When writing to page 1 (configuration page) we strongly recommend to carefully follow the instructions in the document "HT1 Transponder Family Communication Protocol Reader - HITAG 1 Transponder". In particular, overwriting the reserved bits in configuration page 1 may lead to reduced reading range of the HT1DC20S30.
LIMITING VALUES All values are in accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL N tD(ret) Toper Tstg B av as Note 1. Resistivity against magnetic pulses. ELECTRICAL CHARACTERISTICS Period time T0 = 8 s (f0 = 125 kHz); note 1. SYMBOL f0 B BTHR(p-p) bandwidth magnetic flux density for data transmission from transponder (peak-to-peak value) f0 = 125 kHz PARAMETER resonant frequency CONDITIONS MIN. 120 2.3 50 TYP. 125 - - MAX. UNIT 130 - 400(2) kHz kHz T PARAMETER data retention time of EEPROM operating temperature storage temperature magnetic flux density vibration acceleration shock acceleration note 1 10 to 2000 Hz; 3 axis; IEC 68-2-6; Test Fc 3 axis; IEC 68-2-27; Test Ea CONDITIONS Tamb = 55 C MIN. 100000 10 -40 -55 - - - - - +85 +125 0.2 10 1500 years C C T g g MAX. UNIT number of erase/write cycles of EEPROM Tamb = 22 C
BPRG(p-p)
magnetic flux density for programming the f0 = 125 kHz; m = 0.95; EEPROM (peak-to-peak value) tLOW = 8T0 f0 = 125 kHz; m = 0.95; tLOW = 8T0 f0 = 125 kHz; Bfield = 50 T (p-p) f0 = 125 kHz; Bfield = 50 T (p-p); tLOW = 8 T0; see Fig.2
50 50 8 95
- - - -
400(2) T 400(2) T - 100 T %
BAUTH(p-p) magnetic flux density for mutual authentication (peak-to-peak value) BREAD(p-p) field absorption due to the modulation of the transponder (peak-to-peak value) MIPRG modulation index (m) of the base station for programming and authentication
Notes 1. All parameters are characterized with the SCEMTEC test equipment (STM-1) available from SCEMTEC, Reichshof-Wenrath, Germany. All parameters are guaranteed within the temperature range of Tamb = -40 to +85 C. 2. Maximum available field strength of the test equipment. Transponder limit has not been characterized.
2001 Sep 24
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Philips Semiconductors
Product specification
HITAG 1 stick transponder
HT1DC20S30
idth
Definitions: B max - B min m = ----------------------------------B +B max min m read = B max - B min
Bmax Bmin
MGW174
Fig.2 Definition of modulation index.
MECHANICAL CHARACTERISTICS The transponder is sealed in epoxy resin moulding compound. The designation of the package is SOT385-1 (see Chapter "Package outline"). PARAMETER Mechanical dimensions Protection class Casting material Transponder IC type 12 x 6 x 3 mm IP67 epoxy resin HT1ICS30 VALUE
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Philips Semiconductors
Product specification
HITAG 1 stick transponder
PACKAGE OUTLINE PLLMC: plastic leadless module carrier
HT1DC20S30
SOT385-1
D
A
A1 A2
E1 E
A
D1
A3 A
Cross section A-A (not to scale)
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 3.05 2.90 A1 1.2 1.1 A2 0.165 A3 2.1 1.9 D (1) 12.1 11.9 D1(1) 5.1 4.9 E (1) 6.1 5.9 E1(1) 4.6 4.4 46 44o
o
Note 1. Plastic protrusions of 0.2 mm per side are not included. OUTLINE VERSION SOT385-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 01-06-27
2001 Sep 24
6
Philips Semiconductors
Product specification
HITAG 1 stick transponder
DATA SHEET STATUS DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2) Development DEFINITIONS
HT1DC20S30
This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A.
Preliminary data
Qualification
Product data
Production
Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
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Philips Semiconductors - a worldwide company
Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
(c) Koninklijke Philips Electronics N.V. 2001
SCA73
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
613502/02/pp8
Date of release: 2001
Sep 24
Document order number:
9397 750 08336

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